Celanese to Demo “Smart Parts” at National Plastics Expo
Tue, March 17 2015
Four industry-leading companies will mold a complex part simulating a medical device cover at the 2015 plastics showcase
Celanese, Mold Craft, Sodick, and LPKF have teamed up to showcase the
innovative value propositions that exist for device manufacturers when
choosing industry-leading experts as partners for their sensor design
and manufacturing needs. The result of this inventive partnership will
be exhibited at booth S27001 at this year’s NPE where the four companies
will mold a complex part using Celanese Vectra® LCP that simulates a
medical device cover called a
“Miniaturization is a top priority of advanced sensor and electronics
technology manufacturers,” said
Celanese is a leading global supplier of high-performance engineering polymers designed to drive growth and innovation across all industries. Celanese Vectra® LCP is the ideal material for compact, intricate, thin-wall designs, such as this. In addition to Vectra® LCP, Celanese also produces the Zenite® LCP series. These LCP products offer excellent melt flowability, part dimensional stability, and fast cycle times, which will be proven during the on-site molding at NPE 2015.
Mold Craft created a small, thin-walled part with different surface finishes, special cavity inserts, and very tight tolerances. This part demonstrates small pitch features within the mold cavity and ability to maintain tolerances as tight as ±.0001” resulting in crisp detail. This is achieved by Mold Craft’s Design for Manufacturing (DFM) capabilities, which also enables interchangeable cavity inserts.
Sodick’s LP20EH3 micro injection molding machine has been engineered to be the most precise machine on the market, using a two-stage plunger injection unit without a check ring and a true hybrid precision clamping mechanism. Sodick will use robotics to unload molded parts from the machine on the NPE 2015 show floor.
LPKF Laser & Electronics engineered the feature-rich design and 3D circuitry on the part. Using laser direct structuring (LDS), the circuitry is laser-etched on various areas on the part and then selectively plated using electroless copper metallization with ENIG finish.
Celanese Technical Presentations at SPE’s Annual
Celanese subject matter experts will also present the latest innovations
and newest applications of the company’s polymer product portfolio at
the Society of Plastics Engineers’ Annual
Color and Appearance Colored Resin Topics
Introduction to
Color Technology
Keynote:
Bioplastics Bioplastics Session
Cellulose Acetate As a
Tunable Bio-based Engineered Material
Speaker:
Plastics in Building and Construction Plastics in Building and
Construction Session
Health Product Declarations – The Good,
the Bad, and the Ugly
Keynote:
Thermoplastic Materials and Foams Thermoplastics Session
Thermotropic
Liquid Crystalline Powder
Low-Permeation Toughened PolyOxymethylene (POM) for Injection-molded and
Blow-molded
Tanks in Small Off-road Engine (SORE) Applications
Thermoplastic Elastomers - Thermoplastic Elastomers Session
Injection
Overmolding Performance of Thermoplastic Polyester Elastomers (TPC-ET)
About Celanese
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