Zenite® LCP from Celanese Improves High-End Compact Camera Modules in Portable Devices
Thu, April 17 2014
Reduces particle generation and dust attraction
Showcased at Celanese booth N2B01
in the Chemicals &
Device users are demanding ultra slim, high definition options that require CCM manufacturers to design components with a focus on multifunctional integration, better performance and low power consumption. As a result, CCM manufacturers are looking for ways to improve their products and manufacturing processes. In response, Celanese formulated Zenite LCP to deliver superior dimensional stability and less particle generation for improved productivity and higher yield of assembled CCM parts.
“Celanese worked closely with major global CCM manufacturers to develop
this Zenite LCP technical breakthrough that provides electrostatic
discharge properties,” said
Designed for fixed- and auto-focus components, this innovative Zenite LCP provides:
- excellent dimensional stability;
- low moisture absorption;
- high flow;
- reduced particles;
- high weldline strength;
- improved surface quality;
- electrostatic discharge properties.
In 2012, Celanese introduced the high flow, high performance Vectra FIT70 for compact camera modules and Vectra FIT72 for thin-wall connectors. They are used in CCM products for mobile handset cameras.
The Vectra FIT LCPs, with reduced melt viscosity without a loss of mechanical properties, provide high flow and improved flatness and each is designed to meet specific customer requirements.
Vectra and Zenite LCPs are widely used by customers to make halogen-free, eco-friendly connectors, bobbins, switches and relays that meet Restriction of Hazardous Substances Directive (RoHS) and European Waste Electrical and Electronic Equipment (WEEE) directives. In addition, customers and original equipment manufacturers are striving to accelerate the production of green and safe products.
“Material innovation is a hallmark of Celanese material scientists who
are known around the world for developing superior new materials for the
electronics industry,” said
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